Small scale actuators and methods for their formation and use

ABSTRACT

An actuator assembly and method for making and using an actuator assembly. In one embodiment, the assembly includes an actuator body having an actuator channel with a first region and a second region. An actuator is disposed in the actuator channel and is movable when in a flowable state between a first position and a second position. A heater is positioned proximate to the actuator channel to heat the actuator from a solid state to a flowable state. A source of gas or other propellant is positioned proximate to the actuator channel to drive the actuator from the first position to the second position. The actuator has a higher surface tension when engaged with the second region of the channel than when engaged with the first region. Accordingly, the actuator can halt upon reaching the second region of the channel due to the increased surface tension between the actuator and the second region of the channel.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.09/644,365 now U.S. Pat. No. 6,581,479, filed on Aug. 23, 2000.

TECHNICAL FIELD

The present invention is directed toward small actuators for devicessuch as valves, and methods for forming and using such actuators.

BACKGROUND

Microvalves are miniature valves used to control fluid flows at low flowrates. Such valves and other micro-electromechanical (MEMS) devices areconventionally used in several industrial and professional applicationswhere it is important to precisely regulate the flow of small quantitiesof gases or liquids. For example, microvalves are used for some types ofmedical research (such as DNA research), medical treatments, and othertypes of applications that involve metering fluids at low flow rates.

Some conventional microvalves are formed directly in a semiconductorsubstrate (such as silicon) using techniques generally similar to thoseused to form integrated circuits. Such valves typically include aflexible diaphragm that opens and closes a fluid orifice when selectedvoltages are applied to the valve. Examples of such valves are disclosedin U.S. Pat. No. 5,810,325 to Carr, which is incorporated herein in itsentirety by reference.

One drawback with some conventional diaphragm microvalves of the typedescribed above is that the valves may fail because the diaphragm canfracture or deform after repeated uses. Another drawback is thatconventional diaphragms typically do not exert a large sealing force toclose the fluid orifice. Accordingly, such diaphragms may not besuitable for valves that regulate high pressure fluids.

SUMMARY

The present invention is directed toward actuators and methods forforming and using actuators. An actuator assembly in accordance with oneaspect of the invention includes an actuator body having an actuatorchannel with a first end and a second end spaced apart from the firstend. An actuator is disposed in the actuator channel and is movable whenin a flowable state from a first position in the actuator channel to asecond position in the actuator channel. Accordingly, the assembly canfurther include a heater positioned proximate to the actuator channel toheat the actuator from a solid state to a flowable state. In a furtheraspect of the invention, the actuator body can include a fluidpassageway having an orifice in fluid communication with the actuatorchannel. Accordingly, the actuator can allow fluid to flow through theorifice when the actuator is in the first position and block the flow offluid through the orifice when in the second position.

The invention is also directed toward a method for manufacturing anactuator. In one aspect of the invention, the method can include forminga channel in a substrate, positioning an actuator in the channel withthe actuator being movable within the channel between a first positionand a second position when the actuator is in a flowable state, anddisposing an actuator heater adjacent to the channel with the actuatorheater configured to at least partially liquify the actuator. The methodcan further include forming the channel to have a first region and atleast one second region adjacent to the first region. The first regioncan have a first surface characteristic, and the second region can havea second surface characteristic different than the first surfacecharacteristic. The actuator can have a first surface tension when in aflowable state and contacting the first region, and the actuator canhave a second surface tension when in a flowable state and contactingthe second region. The second surface tension can be greater than thefirst surface tension such that the actuator can halt its movementthrough the channel upon contacting the second region.

The invention is also directed toward a method for controlling anactuator. The method can include heating the actuator in an actuatorchannel from a solid state to a flowable state, moving the actuator in afirst region of the actuator channel from a first position to a secondposition, and cooling the actuator to solidify the actuator in a secondposition. The method can further include halting the motion of theflowable actuator at the second position by engaging the actuator with asurface of a second region of the channel. For example, the actuator canhave a surface tension when in contact with the second region that ishigher than a surface tension of the actuator when in contact with thefirst region such that the actuator can halt its movement in the channelupon contacting the second region.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partially exploded top isometric view of an actuatorassembly in accordance with an embodiment of the invention.

FIG. 2 is a cross-sectional side view illustrating a process fordepositing an actuator on a portion of the assembly shown in FIG. 1 inaccordance with an embodiment of the invention.

FIGS. 3A-3B are cross-sectional side views illustrating additionalprocesses for forming the actuator shown in FIG. 2 in accordance with anembodiment of the invention.

FIG. 4 is a top isometric view of a portion of an assembly having anactuator with a slider portion in accordance with another embodiment ofthe invention.

FIG. 5 is a partially schematic view of a valve assembly in accordancewith yet another embodiment of the invention.

DETAILED DESCRIPTION

The present disclosure describes actuators, such as valve actuators, andmethods for making and using such actuators. Many specific details ofcertain embodiments of the invention are set forth in the followingdescription and in FIGS. 1-5 to provide a thorough understanding ofthese embodiments. One skilled in the art, however, will understand thatthe present invention may have additional embodiments, or that theinvention may be practiced without several of the details describedbelow.

FIG. 1 is a partially exploded top isometric view of an actuatorassembly 10 formed in accordance with an embodiment of the invention. Inone aspect of this embodiment, the assembly 10 is configured to regulatea flow of fluid (liquid, gas or another flowable substance) through afluid passageway 30. Accordingly, the assembly 10 can include a body 11having a first portion 11 a that houses the fluid passageway 30 and asecond portion 11 b attached to the first portion 11 a. The firstportion 11 a can include an actuator or piston 50 that slides within anactuator channel or piston channel 20 to either open or close a segmentof the fluid passageway 30.

In one embodiment, the body 11 can be formed from a semiconductormaterial, such as silicon. Accordingly, the features formed in the body11 can be formed using techniques generally similar to thoseconventionally used for forming integrated circuits in semiconductorsubstrates, as described in greater detail below. In other embodiments,the body 11 can be formed from non-semiconductor materials and/or withother techniques. In either embodiment, many of the features of the body11 can be formed separately in the first portion 11 a and the secondportion 11 b. The portions 11 a, 11 b can subsequently be joined byattaching an upper surface 12 of the first portion 11 a to a lowersurface 14 of the second portion 11 b. Accordingly, the first portion 11a can include a bonding layer 13 to promote adhesion between the firstportion 11 a and the second portion 11 b. Alternatively, the secondportion 11 b can include a bonding layer in addition to or in lieu ofthe bonding layer on the first portion 11 a, or the bonding layer 13 canbe eliminated.

In one embodiment, the channel 20 in the body 11 can include a bottomsurface 21 and opposing side surfaces 22 in the first portion 11 a, anda top surface 23 in the second portion 11 b. Accordingly, the channel 20can be completely enclosed when the second portion 11 b is joined to thefirst portion 11 a. In one aspect of this embodiment, the side issurfaces 22 can be perpendicular to the bottom surface 21.Alternatively, the side surfaces 22 can be canted relative to the bottomsurface 21. In either embodiment, the channel 20 can have a firstunwetted region 25 a (shown by left cross-hatching) toward a first end26 of the channel 20, a second unwetted region 25 b (shown by rightcross-hatching) toward a second end 27 of the channel 20, and a wettedregion 24 between the first and second unwetted regions 25 a, 25 b. Thefluid passageway 30 intersects the channel 20 in the wetted region 24.Accordingly, the fluid passageway 30 can have an entrance orifice 31 inone side surface 22 of the channel 20 and an exit orifice 32 in theopposite side surface 22.

The actuator 50 is positioned in the wetted region 24 proximate to theentrance orifice 31 and the exit orifice 32. When the actuator 50 is ina liquid state (or another flowable state), it can wet and seal againstthe bottom surface 21, the side surfaces 22 and the top surface 23 ofthe channel 20. The actuator 50 can also move back and forth along thewetted region 24, as indicated by arrows “A” and “B,” when in theflowable state to close and open the entrance orifice 31.

In a further aspect of this embodiment, the actuator 50 will not moveinto either of the unwetted regions 25 a, 25 b due to high capillaryforces associated with the interface between the actuator 50 and theunwetted regions 25 a, 25 b. Accordingly, the motion of the actuator 50can be limited to linear travel between a first position and a secondposition. In the first or open position (shown in FIG. 1), the actuator50 is spaced apart from the entrance orifice 31 and the exit orifice 32of the fluid passageway 30 to allow fluid to pass through the fluidpassageway 30 from the entrance orifice 31 across the channel 20 to theexit orifice 32. In the second or closed position, the actuator 50 ispositioned between the entrance orifice 31 and the exit orifice 32 toblock the flow of fluid through the fluid passageway 30 beyond theentrance orifice 31.

In one aspect of an embodiment of the assembly 10 shown in FIG. 1, theactuator 50 can be moved back and forth within the channel 20 bysequentially introducing a gas toward one of the first end 26 or thesecond end 27 of the channel 20. For example, the assembly 10 caninclude two gas sources 40 shown in FIG. 1 as a first gas source 40 atoward the first end 26 and a second gas source 40 b toward the secondend 27. In a further aspect of this embodiment, each gas source 40 caninclude a metal hydride that releases hydrogen when heated and reabsorbsthe hydrogen when cooled. Accordingly, the first gas source 40 a can beheated to release hydrogen into the channel 20 toward the first end 26and drive the actuator 50 toward the closed position, as indicated byarrow A. Alternatively, the second gas source 40 b can be heated torelease hydrogen toward the second end 27 of the channel 20 and drivethe actuator 50 toward the open position, as indicated by arrow B.Additional materials relating to metal hydrides and other gas-containingmetals are included in Chapter 8 of “Scientific Foundations of VacuumTechnique,” by S. Dushman and J. M. Latterly (1962), and in pending U.S.patent application Ser. Nos. 09/546,084 and 09/258,363, all incorporatedherein in their entirety by reference.

In one embodiment, the body 11 can include vent channels 43 coupled tothe gas sources 40 and/or the channel 20. The vent channels 43 canprovide a safety outlet for hydrogen at the gas source 40 and/or in thechannel 20 to vent the hydrogen if the pressure of the hydrogen exceedsa preselected value. The vent channels 43 can also dampen pressurepulses produced by the gas sources 40 by receiving some of the gasreleased by the gas sources 40. Alternatively, the vent channels 43 canrelease the hydrogen produced by the gas sources 40 from the assembly 10during normal operation. Accordingly, the hydrogen is not reabsorbed bythe gas sources 40. In a further aspect of this alternate embodiment,the gas sources 40 can be used for a limited number of actuatormovements, or the gas sources 40 can be replenished with gas from anexternal source.

In yet another aspect of an embodiment of the assembly 10 shown in FIG.1, the body 11 can include one or more heaters for controlling thetemperature of the gas sources 40 and/or the actuator 50. For example,the body 11 can include gas source heaters 41 adjacent to and thermallycoupled to each of the gas sources 40 to independently heat the gassources 40 and release the hydrogen (or other gas) from the gas sources40. The body 11 can further include an actuator heater 42 positionedadjacent to and thermally coupled to the wetted region 24 of the channel20 to heat and at least partially liquify the actuator 50 prior tomoving the actuator 50 within the channel 20. The heaters can beindependently controlled to achieve the temperature necessary to releasegas from the gas sources 40 and at least partially liquify the actuator50 at selected phases during the operation of the assembly 10, as willbe described in greater detail below. The heaters can be positioned inthe first portion 11 a of the body 11 (as shown in FIG. 1) oralternatively, the heaters can be positioned in the second portion 11 b.

The materials forming channel 20 and the actuator 50 can be selected toenhance the performance of the actuator 50 in the channel 20. Forexample, the wetted region 24 of the channel 20 can include a coating ofa noble metal (such as platinum or gold), or another metal (such apalladium or rhodium) that resists corrosion and/or is easily wetted bythe actuator 50 when the actuator 50 is in an at least partiallyflowable state. The actuator 50 can accordingly include a material thathas a relatively low melting point and that readily wets the wettedregion 24. Suitable materials for the actuator 50 include lead and leadalloys (such as are found in solders), bismuth, cadmium, selenium,thallium, tin and/or zinc. In other embodiments, the actuator 50 caninclude other metals, alloys, inorganic and/or organic materials, solong as the actuator 50 can achieve an at least partially flowable statewhen heated and/or can be halted by contact with the non-wetted regions25 a, 25 b. Conversely, the non-wetted regions 25 a, 25 b of the channel20 can be coated with a material that is not easily wetted by theactuator 50. For example, when the actuator 50 includes lead or a leadalloy, the non-wetted regions 25 a, 25 b can include an oxide or anitride, such as silicon dioxide, aluminum oxide, or silicon nitride. Inany of these embodiments, the materials selected for the body 11, thewetted region 24 and the non-wetted regions 25 have a higher meltingpoint than the material selected for the actuator 50 so that only theactuator 50 will melt when the actuator heater 42 is activated.

In operation, the fluid passageway 30 is coupled to a source of fluid(not shown in FIG. 1). The actuator heater 42 is activated to at leastpartially melt the actuator 50 and/or otherwise increase the flowabilityof at least the external surfaces of the actuator 50 while the actuator50 remains sealably engaged with the surfaces of the channel 20. Thefirst gas source 40 a is activated (for example, by activating theadjacent gas source heater 41) to release gas into the channel 20 towardthe first end 26 and drive the actuator 50 from its first or openposition (shown in FIG. 1) to its second or closed position between theentrance orifice 31 and the exit orifice 32 of the fluid passageway 30.The actuator 50 halts when it reaches the second unwetted region 25 b,due to very strong capillary forces at the interface between theactuator 50 and the second unwetted region 25 b. The actuator heater 42is then deactivated to solidify the actuator 50 in its closed positionwith the actuator 50 sealed against the surfaces 21, 22 and 23 of thechannel 20. The gas source heater 41 is then deactivated and the firstgas source 41 a re-absorbs the released gas.

To open the fluid passageway 30, the actuator 50 is heated as describedabove and the second gas source 40 b is activated to drive the actuator50 from the closed position to the open position. The actuator 50 isthen allowed to cool to solidify the actuator 50 in the open positionand seal the actuator 50 against the surfaces of the channel 20. Thesecond gas source 40 b is cooled to allow the gas released into thechannel 20 to reabsorb to the second gas sources 40 b. In oneembodiment, the foregoing steps can be repeated to cycle the actuator 50back and forth between the open position and the closed position at afrequency of up to at least 1,000 cycles per second. In otherembodiments, the actuator 50 can be cycled at other frequencies higheror lower than 1,000 cycles per second.

In one embodiment, the assembly 10 can be formed in silicon or anothersemiconductor substrate using photolithographic masking and etchingtechniques to define several features of the assembly 10. For example,when the gas source heaters 41 and the actuator heater 42 includeelectrical resistance heaters, the heaters 41, 42 can be formed directlyin the first portion 11 a by first etching cavities to accommodate theheaters and then depositing or otherwise disposing in the cavities aconductive material that achieves the desired temperature when anelectrical current is applied to the conductive material. Alternatively,the heaters 41 and 42 can be positioned in the second portion 11 b usingsimilar techniques.

The channel 20 can also be formed in the first portion 11 a using anetching technique. In one embodiment, the bottom surface 21 and the sidesurfaces 22 of the channel 20 (including the wetted region 24 and thenon-wetted regions 25 a and 25 b) can then be oxidized. Next, the wettedregion 24 can be coated with a metal adhesion layer, such as chromium,followed by a noble metal film, such as platinum, or another wettablemetal material. The top surface 23 of the channel 20 (in the secondportion 11 b) can be processed in a generally similar manner.

Before the second portion 11 b is attached to the first portion 11 a,the actuator 50 is positioned in the wetted region 24 of the channel 20.In one embodiment, the volume of material forming the actuator 50 isselected to span the channel 20 from one side surface 22 to the otherand from the bottom surface 21 to the top surface 23 when the bodysecond portion 11 b is attached to the first portion 11 a. However, thevolume of actuator material does not occupy the entire wetted region 24to allow for movement of the actuator 50 back and forth between the openand closed positions. When the gas sources 40 include metal hydrides,they can be deposited directly in the ends 26 and 27 of the channel 20.Alternatively, the hydride or other gas source 40 can be pre-formed andpositioned in the channel 20. The second portion 11 b of the body 11 canthen be attached to the first portion 11 a in an inert or a reducingenvironment to promote adhesion between the two portions.

In one embodiment, the actuator 50 can be disposed in the channel 20using a conventional etch and photomask process. For example, thematerial forming the actuator 50 can be deposited directly into thechannel 20 (and, in one embodiment, over other parts of the firstportion 11 a). A layer of photoresist material can be applied to theactuator material and a positive or negative mask can be used toeliminate the photoresist from all regions except a region that definesthe outline of the actuator 50. The remaining photoresist shields theportion of the actuator material that defines the actuator 50 and theexcess actuator material is etched away using conventional etchants.

FIG. 2 illustrates an alternate method for disposing the actuator 50 inthe channel 20 in accordance with another embodiment of the invention.This method may be suitable where it is difficult to remove the excessactuator material with an etching process. In one aspect of thisembodiment, a spacer layer 62 and a resist layer 60 are disposed on thebottom surface 21 of the channel 20 and on other parts of the firstportion 11 a. An aperture 61 is formed in the resist layer 60 and thespacer layer 62 and is aligned with an actuator deposition region 56 inthe channel 20. The spacer layer 62 can be undercut (for example, byetching the spacer layer 62) so that the resist layer 60 has anoverhanging portion 63 that faces directly toward the bottom surface 21of the channel 20. The actuator material 55 is deposited on the firstportion 11 a to form the actuator 50 in the actuator deposition region56 and an excess portion 57 of the actuator material 55 on the resistlayer 60. The excess portion 57 and the resist layer 60 are then removedby dissolving the spacer layer 62 with an appropriate solvent. Theoverhanging portion 63 can reduce the likelihood for “bridging” betweenthe actuator 50 and spacer layer 62, and can also provide an accesschannel for the solvent.

FIG. 3A is a cross-sectional side view of a portion of the assembly 10described above with reference to FIG. 1 immediately after attaching thesecond portion 11 b to the first portion 11 a. In one aspect of thisembodiment, the actuator 50 is initially disposed in the actuatorchannel 20 in a solid state to extend over a portion of the wettedregion 24 and the first unwetted region 25 a. The actuator 50 projectsupwardly from the bottom surface 21 of the channel 20, but does notinitially contact the top surface 23. When an electrical current isapplied to the actuator heater 42, the actuator 50 liquifies. Becausethe surface tension between the liquified actuator 50 and the firstunwetted region 25 a is substantially higher than between the liquifiedactuator 50 and the wetted region 24, the actuator 50 retracts from theunwetted region 25 a to form a meniscus at the interface between thewetted region 24 and the unwetted region 25 a, as shown in FIG. 3B. In afurther aspect of this embodiment, the liquified actuator 50 wicksupwardly along the side surfaces 22 of the channel 20 to engage the topsurface 23. Accordingly, the actuator 50 can fill the entirecross-sectional flow area of the channel 20 (as shown in FIG. 1) afterits initial liquifaction. When the actuator 50 cools and solidifies, itcan form a sealed interface with the surfaces of the channel 20 toprevent fluid in the fluid passageway 30 (FIG. 1) from escaping past theactuator 50 toward the ends 26, 27 (FIG. 1) of the channel 20. In oneembodiment, the actuator 50 can have a length approximately equal totwice its height, and in other embodiments, the actuator 50 can haveother dimensions, depending on the dimensions of the channel 20.

In still further embodiments, the actuator 50 can be disposed in thechannel 20 in other manners. For example, the actuator 50 can initiallybe positioned to reside entirely within the wetted region 24, ratherthan extending into the first unwetted region 25 a. The actuator 50 thenwicks up the side surfaces 22 to the top surface 23 of the channel uponbeing heated, as described above. Alternatively, the actuator 50 can beinitially disposed in the channel 20 in a liquid form, provided that theenvironment in which the assembly 10 is formed has a temperature abovethe melting point of the actuator 50.

One feature of an embodiment of the assembly 10 described above withreference to FIGS. 1-3 is that the channel 20 and the actuator 50 can bemade extremely compact by forming these and other elements of theassembly 10 directly in the body 11. Accordingly, the overall dimensionsof the assembly 10 can be suitable for many subminiature applications.For example, (referring now to FIG. 1) the channel 20 can have a width“W” of from about one micron to about five microns and a length “L” offrom about two microns to about 50 microns. In other embodiments, thedimensions of the channel 20 can be smaller, provided that thetechniques for forming the channel 20 and other components of theassembly 10 are compatible with the reduced dimensions. Conversely, thechannel 20 and the actuator 50 can be larger in still furtherembodiments provided that (a) the actuator 50 can remain in contact withthe surfaces 21, 22, and 23 of the channel 20 when in a liquid state,and (b) the actuator 50 does not develop so much momentum as it moveswithin the channel 20 that it crosses from the wetted region 24 intoeither of the unwetted regions 25 a, 25 b.

Another feature of an embodiment of the assembly 10 described above withreference to FIGS. 1-3 is that the actuator 50 is in a liquid orotherwise flowable state when it is in motion, and can be solidifiedwhen at rest. An advantage of this feature is that the actuator 50 canrequire less force than some conventional actuators to move betweenpositions because of the relatively low friction between the liquidactuator 50 and the surfaces of the channel 20. Another advantage isthat the actuator 50 may be less susceptible to accidental actuation(for example, in a high pressure or high acceleration environment)because the actuator 50 will not move unless it is heated. Still anotheradvantage is that the actuator 50 can form a strong, liquid-tight and/orgas-tight bond with the surfaces of the channel 20 (generally similar tothe bond between solder and soldered wires) when the actuator 50 is inthe solid state. Accordingly, the actuator 50 can withstand highpressures when in the solid state.

Still another advantage of an embodiment of the actuator 50 is that thesurface tension and the volume free energy of the actuator act tominimize the length of the actuator 50 and preserve the integrity of theactuator when the actuator is in a liquid state. Accordingly, theactuator 50 can withstand relatively high pressures (such as thepressure of the fluid acting or the actuator 50 through the entranceorifice 31) without becoming fragmented, even when the actuator is in aliquified or partially liquified state.

Yet another feature of an embodiment of the assembly 10 is that theactuator 50 can perform functions other than the valve functionsdescribed above with reference to FIGS. 1-3. For example, in oneembodiment, the heaters 41 and 42 can be eliminated and the actuator 50can move when the temperature of its environment increases by an amountsufficient to liquify the actuator 50 and release gas from one of thegas sources 40. Accordingly, the actuator 50 can be coupled to a firesuppression system or other heat-activated device. In other embodiments,the actuator 50 can be operatively coupled to elements other than afluid channel, such as electrical contacts of a fuse or a relay totransmit linear motion to the other elements. In other embodiments, theactuator 50 can have other functions and/or can be operatively coupledto other devices.

FIG. 4 is a top isometric view of a portion of an assembly 110 having anactuator 150 configured in accordance with another embodiment of theinvention. In one aspect of this embodiment, the assembly 110 caninclude a body 111 having a first portion 111 a with a channel 120 and asecond portion 111 b generally similar to the first portion 11 a andsecond portion 11 b described above with reference to FIGS. 1-3B. Theactuator 150 is disposed in the channel 120 and is movable within thechannel (as indicated by arrows “C” and “D”) between a first position(shown in FIG. 4) and a second position. In the first position, theactuator 150 allows a fluid to pass through a fluid passageway 130 froman entrance orifice 131 across the channel 120 to an exit orifice 132.In the second position, the actuator 150 blocks the motion of fluid fromthe entrance orifice 131 to the exit orifice 132, as will be describedin greater detail below.

In one embodiment, the actuator 150 includes two flowable portions 151positioned at opposite ends of a non-flowable slider portion 152. Theflowable portions 151 operate in a manner generally similar to thatdescribed above with reference to FIGS. 1-3 to liquify and move theactuator 150 over a wetted region 124 of the channel 120 positionedbetween a first unwetted region 125 a and a second unwetted region 125b. Conversely, the slider portion 152 can remain in a solid statethroughout the operation of the actuator 150 in one embodiment.

In one aspect of this embodiment, the slider portion 152 includes agroove 158 that extends across the width “W” of the channel 120. Thegroove 158 is aligned with the entrance orifice 131 and the exit orifice132 when the actuator 150 is in the open position to allow fluid to passfrom the entrance orifice 131 to the exit orifice 132. The groove 158 isoffset from the entrance orifice 131 and the exit orifice 132 when theactuator 150 is in the closed position to prevent the fluid from passingfrom the entrance orifice 131 to the exit orifice 132. As the sliderportion 152 moves back and forth between the open and closed positions,the flowable portions 151 of the actuator 150 can seal against thesurfaces of the channel 120 and the slider portion 152 to prevent thefluid from escaping past the actuator 150 toward opposite ends 126 and127 of the channel 120.

In one embodiment, the slider portion 152 can be formed from ahydrogenated amorphous silicon carbide. In one aspect of thisembodiment, the slider portion 152 can be formed by depositing in thechannel 120 an Si_(x)C_(y):H compound by plasma enhanced chemical vapordeposition (PECVD). The adhesive forces between the resulting sliderportion 152 and the surfaces of the channel 120 can be reduced in oneembodiment by lowering the temperature at which the PECVD process occursand/or by adding CF₄ to the plasma to form a Si_(x)C_(y)F_(z):H film.The resulting carbide slider portion 152 can be mechanically polished toproduce a flat surface for mating with a top surface 123 of the channel120 defined by the second portion of the body 111. The groove 158 can beformed in the slider portion 152 by a reactive ion etching process,which can also be used to remove any extraneous carbide in the channel120. In other embodiments, the slider portion 152 can be formed fromother materials and/or by other processes.

One feature of an embodiment of the assembly 110 described above withreference to FIG. 4 is that the slider portions 152 can isolate thefluid passing through the passage 130 from contact with the flowableportions 151. An advantage of this feature is that the assembly 110 canbe used to control the flow of fluids that are not compatible with thematerials forming the flowable portions 151 of the actuator 150. Anotheradvantage of this feature is that the slider portion 152 can isolate thefluid in the passageway 130 from contact with the wetted region 124 ofthe channel 120. Accordingly, the assembly 110 can reduce the likelihoodfor oxidizing or otherwise contaminating the wetted region 124.

FIG. 5 is a schematic illustration of a valve assembly 280 configured toincrementally vary a flow of fluid in accordance with another embodimentof the invention. In one aspect of this embodiment, the valve assembly280 can include four multiplexed valves 210 (shown as valves 210 a-210d), each configured in a manner generally similar to the assembly 10 orthe assembly 110 described above with reference to FIGS. 1-4.Accordingly, each valve 210 has a entrance orifice 231, an exit orifice232, and an actuator (not shown in FIG. 5) that can move back and forthbetween the entrance orifice 231 and the exit orifice 232 to open andclose fluid communication between each pair of entrance and exitorifices. In a further aspect of this embodiment, each valve 210 canhave a separate gas source for driving each valve actuator.Alternatively, a pair of gas sources (one for each direction of travelof the actuators) can be coupled to all the valves 210 a-210 d, withonly selected valve actuators moving, depending on which actuatorheaters are activated.

In a further aspect of this embodiment, each entrance orifice 231 can becoupled to an entrance manifold 282 which is in turn coupled to a source284 of fluid. Each exit orifice 232 can be coupled to an exit manifold283 which can in turn be coupled to downstream devices (not shown).Alternatively, the valves 210 a-210 d can be coupled to differentsources 284, for example, to mix fluids from the different sources.

In still another aspect of this embodiment, each valve 210 can have adifferent flow capacity. For example, the first valve 210 a can have aflow capacity of one flow rate unit, the second valve 210 b can have aflow capacity of two flow rate units, the third valve 210 c can have aflow capacity of three flow rate units, and the fourth valve 210 d canhave a capacity of four flow rate units. By selectively opening one ormore of the valves 210 a-210 d, the valve assembly 280 can allow a fluidflow having any integer value of from zero flow rate units to 10 flowrate units to pass from the entrance manifold 282 to the exit manifold283. Accordingly, while each individual valve 210 does not incrementallyadjust the flow of fluid from the entrance manifold 282 to the exitmanifold 283, the combination of valves 210 can provide such anincremental adjustment. In other embodiments, other combinations ofvalves and valve capacities can be used to provide more or fewerincremental flow rates. In one embodiment, the valves 210 a-210 d can beformed in a single substrate (such as a semiconductor substrate) oralternatively, one or more of the valves 210 a-210 d can be formed in aseparate substrate.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from thespirit and scope of the invention. Accordingly, the invention is notlimited expect as by the appended claims.

1. A method for controlling an actuator, comprising: heating theactuator in an actuator channel from a solid state to a flowable state;moving the actuator within the actuator channel from a first position toa second position with a flowable portion of the actuator in contactwith surfaces of the actuator channel, the flowable portion of theactuator having a first surface tension when adjacent to the firstposition in the actuator channel and a second surface tension greaterthan the first surface tension when adjacent to the second position inthe actuator channel; cooling the actuator to solidify the actuator inthe second position; and moving the actuator from the second position tothe first position.
 2. The method of claim 1 further comprisingliquifying the actuator before moving the actuator from the firstposition to the second position.
 3. The method of claim 1, furthercomprising covering an orifice to at least restrict a flow of fluidthrough the orifice by moving the actuator from the first position tothe second position.
 4. The method of claim 1 wherein moving theactuator includes applying pressurized gas to the actuator.
 5. Themethod of claim 1 wherein moving the actuator includes: heating a firsthydride material to release hydrogen into the actuator channel on afirst side of the actuator to drive the actuator in a first direction;heating a second hydride material to release hydrogen into the actuatorchannel on a second side of the actuator to drive the actuator in asecond direction opposite the first direction; and cooling at least oneof the first and second hydride materials to reabsorb at least some ofthe hydrogen.
 6. The method of claim 1 wherein heating the actuatorincludes heating a portion of the actuator that includes at least one oflead, tin, bismuth, cadmium, selenium, thallium and zinc.
 7. The methodof claim 1 wherein moving the actuator includes moving the actuator overa surface that includes at least one of platinum, rhodium, palladium andgold.
 8. The method of claim 1 wherein moving the actuator from thefirst position to the second position includes halting motion of theactuator at the second position by engaging the actuator with at leastone of an oxide surface and a nitride surface.
 9. The method of claim 1wherein moving the actuator from the second position to the firstposition includes reheating the actuator in the actuator channel from asolid state to a flowable state, and moving the actuator within theactuator channel from the second position to the first position with aflowable portion of the actuator in contact with surfaces of theactuator channel.
 10. A method for controlling an actuator, comprising:heating the actuator in an actuator channel from a solid state to aflowable state; moving the actuator within the actuator channel from afirst position to a second position with a flowable portion of theactuator in contact with surfaces of the actuator channel, whereinmoving the actuator includes applying pressurized gas to the flowableportion of the actuator; and cooling the actuator to solidify theactuator in the second position.
 11. A method for controlling anactuator, comprising: heating the actuator in an actuator channel from asolid state to a flowable state; moving the actuator within the actuatorchannel from a first position to a second position with a flowableportion of the actuator in contact with surfaces of the actuatorchannel, wherein moving the actuator includes: heating a first hydridematerial to release hydrogen into the actuator channel against a firstside of the flowable portion of the actuator to drive the actuator in afirst direction; heating a second hydride material to release hydrogeninto the actuator channel against a second side of the flowable portionof the actuator to drive the actuator in a second direction opposite thefirst direction; and cooling at least one of the first and secondhydride materials to reabsorb at least some of the hydrogen; and coolingthe actuator to solidify the actuator in the second position.
 12. Amethod for controlling an actuator, comprising: heating the actuator inan actuator channel from a solid state to a flowable state, whereinheating the actuator includes heating a portion of the actuator thatincludes at least one of lead, tin, bismuth, cadmium, selenium, thalliumand zinc; moving the actuator within the actuator channel from a firstposition to a second position with a flowable portion of the actuator incontact with surfaces of the actuator channel, the flowable portion ofthe actuator having a first surface tension when at the first positionin the actuator channel and a second surface tension greater than thefirst surface tension when adjacent to the second position in theactuator channel; and cooling the actuator to solidify the actuator inthe second position.
 13. A method for controlling an actuator,comprising: heating the actuator in an actuator channel from a solidstate to a flowable state; moving the actuator within the actuatorchannel from a first position to a second position with a flowableportion of the actuator in contact with surfaces of the actuatorchannel, wherein moving the actuator includes applying pressurized gasto the flowable portion of the actuator to move the actuator over asurface that includes at least one of platinum, rhodium, palladium andgold; and cooling the actuator to solidify the actuator in the secondposition.
 14. A method for controlling an actuator, comprising: heatingthe actuator in an actuator channel from a solid state to a flowablestate; moving the actuator within the actuator channel from a firstposition to a second position with a flowable portion of the actuator incontact with surfaces of the actuator channel, wherein moving theactuator from the first position to the second position includes haltingmotion of the actuator at the second position by engaging the actuatorwith at least one of an oxide surface and a nitride surface; and coolingthe actuator to solidify the actuator in the second position.
 15. Amethod for controlling an actuator, comprising: liquefying the actuatorin an actuator channel by heating the actuator; heating a hydride sourceto release hydrogen gas into the actuator channel; driving the hydrogengas against the liquefied actuator to move the liquefied actuator withina first region of the actuator channel from a first position toward asecond position, the liquefied actuator having a first surface tensionwhen in the first region of the actuator channel; halting motion of theliquefied actuator within the actuator channel by engaging the liquefiedactuator with a second region of the actuator channel, the liquefiedactuator having a second surface tension greater than the first surfacetension adjacent to the second region of the actuator channel; andsolidifying the liquefied actuator in the second position by cooling theactuator.
 16. The method of claim 15, further comprising moving theactuator back and forth between the first position and the secondposition at a rate of up to at least 1,000 cycles per second.
 17. Themethod of claim 15 wherein heating a hydride source includes heating afirst hydride source to release hydrogen gas into the actuator channelon a first side of the liquefied actuator to move the liquefied actuatorin a first direction, and further comprising heating a second hydridesource to release hydrogen gas into the actuator channel on a secondside of the actuator to move the liquefied actuator in a seconddirection opposite the first direction.
 18. The method of claim 15wherein heating a hydride source includes heating a first hydride sourceto release hydrogen gas into the actuator channel on a first side of theliquefied actuator to move the liquefied actuator in a first direction,and further comprising: heating a second hydride source to releasehydrogen gas into the actuator channel on a second side of the actuatorto move the liquefied actuator in a second direction opposite the firstdirection; and cooling at least one of the first and second hydridesources to reabsorb at least some of the hydrogen.
 19. The method ofclaim 15, further comprising covering an orifice to at least restrict aflow of fluid through the orifice by moving the actuator from the firstposition to the second position.
 20. The method of claim 15 whereinliquefying the actuator includes heating a portion of the actuator thatincludes at least one of lead, tin, bismuth, cadmium, selenium, thalliumand zinc.
 21. The method of claim 15, wherein moving the actuatorincludes moving the actuator over a surface that includes at least oneof platinum, rhodium, palladium and gold.
 22. The method of claim 15wherein halting motion of the liquefied actuator at the second positionincludes engaging the liquefied actuator with at least one of an oxidesurface and a nitride surface.